Consumer Electronics Innovation Congress (CEIC) 2025

CEIC 2025 Innovation Case Collection

The Consumer Electronics Innovation Congress 2025 (CEIC 2025) is a global consumer electronics exhibition gathering underlying innovations in the key technical fields. The CEIC Organizing Committee is now calling for submissions for innovative pioneer projects worldwide, aiming to discover pioneer projects with significant technological breakthroughs and innovative applications. Submitted projects will undergo independent evaluation by relevant experts and will be announced at CEIC 2025.

The five areas of selected innovation cases are:

OpenHarmony Application Scenario Innovation

Calling for application cases with groundbreaking innovations based on the OpenHarmony OS, particularly in multi-device collaboration, AIoT applications, etc.

SparkLink Intelligent Connection Innovation

Calling for products and application cases with technological innovations, significant experience leaps, and those leading new trends in the field of intelligent connectivity.

Ultra HD Application and Technology Innovation

Calling for industrial applications of technology standards in the ultra-high-definition audio and video field, including technological innovations, products, and application cases.

Network Technology and Application Innovation

Calling for technological standard innovations and industrial applications in the fields of campus networks, wide area networks, data center networks, network automation, etc., including innovative IP technologies and industrial application cases.

New Computing Technology and Application Innovation

Calling for products or solutions that have made outstanding innovative contributions in the computing field, focusing on typical practices in technological breakthroughs related to new computing architectures, scenario innovation, and industrial application.

OpenHarmony Application Scenario Innovation

Calling for application cases with groundbreaking innovations based on the OpenHarmony OS, particularly in multi-device collaboration, AIoT applications, etc.

SparkLink Intelligent Connection Innovation

Calling for products and application cases with technological innovations, significant experience leaps, and those leading new trends in the field of intelligent connectivity.

Ultra HD Application and Technology Innovation

Calling for industrial applications of technology standards in the ultra-high-definition audio and video field, including technological innovations, products, and application cases.

Network Technology and Application Innovation

New Computing Technology and Application Innovation

OpenHarmony Application Scenario Innovation

SparkLink Intelligent Connection Innovation

Ultra HD Application and Technology Innovation

Network Technology and Application Innovation

New Computing Technology and Application Innovation

Hosted by

Co-organized by

International Economic and Technological Cooperation Center of the Ministry of Industry and Information Technology ("National Cooperation Center")

Supported by

Huaqiangbei Subdistrict Office, Futian District, Shenzhen
Artificial Intelligence Terminal Working Group
Shenzhen Federation of Social Organizations
Shenzhen Artificial Intelligence Industry Association
Fast Charging Alliance
Smart Terminal Microelectronics Association Co., Ltd.
ZGC Ultra Interconnection New Infrastructure Industry Innovation Alliance
PHBS EMBA Boyun Club
Shenzhen Branch of SHANGHAI PUDONG DEVELOPMENT BANK CO., LTD SHENZHEN
ICkey (Shanghai) Internet and Technology Co., Ltd

Consumer Electronics Innovation Congress 2025 Organizing Committee
Shenzhen-Hong Kong International Science and Technology Park, Shenzhen, China
+86 18926418506
ceic@cietc.org.cn
www.ceic.net